Patent Assignment
Reel/Frame 067184/0757
Assignment of Assignor's Interest
Recorded: 2024-04-22
Pages: 6
Assignor
AMKOR TECHNOLOGY, INC.
Executed: 2019-11-19
Assignee
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
491B RIVER VALLEY ROAD, VALLEY POINT #12/03, SINGAPORE, 248373, SINGAPORE
Covered Properties
(3)
Semiconductor Package and Fabricating Method Thereof
Electronic Device Package and Fabricating Method Thereof
Semiconductor Device and Manufacturing Method Thereof
Application:
18/606,973 →
Publication:
US 2024/0304583
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 22, 2024
From: KIM, KEUN SOO; KIM, JAE YUN; AHN, BYOUNG JUN; RYU, DONG SOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 067183/0910 →
Assignment of Assignor's Interest
Apr 22, 2024
From: KIM, JIN YOUNG; PARK, NO SUN; KIM, YOON JOO; LEE, SEUNG JAE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 067184/0394 →
Assignment of Assignor's Interest
Apr 22, 2024
From: PAEK, JONG SIK; PARK, DOO HYUN
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 067184/0522 →