IP Library Assignment 067312/0264
Patent Assignment
Reel/Frame 067312/0264

Assignment of Assignor's Interest

Recorded: 2024-05-03 Pages: 14
Assignors
SATO, HIROAKI
Executed: 2012-03-09
KANG, TECK-GYU
Executed: 2012-05-01
HABA, BELGACEM
Executed: 2012-01-18
OSBORN, PHILIP R.
Executed: 2012-05-02
WANG, WEI-SHUN
Executed: 2012-03-13
CHAU, ELLIS
Executed: 2012-03-28
MOHAMMED, ILYAS
Executed: 2012-03-15
MASUDA, NORIHITO
Executed: 2012-05-05
SAKUMA, KAZUO
Executed: 2012-05-01
HASHIMOTO, KIYOAKI
Executed: 2012-04-30
INETARO, KUROSAWA
Executed: 2012-05-01
KIKUCHI, TOMOYUKI
Executed: 2012-05-02
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Package-On-Package Assembly with Wire Bonds to Encapsulation Surface
Application: 18/380,053 →
Publication: US 2024/0203930
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 3, 2024
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 067312/0596 →
Change of Name May 3, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 067312/0605 →