Package-on-package assembly with wire bonds to encapsulation surface
Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A microelectronic die has a lower surface facing the upper surface of the substrate and having second contacts on an upper surface of the microelectronic die. Wire bonds have bases joined to the first contacts and have edge surfaces between the bases and corresponding end surfaces. A first portion of the wire bonds are interconnected between a first portion of the first contacts and the second contacts. The end surfaces of a second portion of the wire bonds are above the upper surface of the microelectronic die. A dielectric layer is above the upper surface of the substrate and between the wire bonds. The second portion of the wire bonds have uppermost portions thereof bent over to be parallel with an upper surface of the dielectric layer.
1 . A method comprising:
providing a substrate having a surface having electrically conductive elements;
disposing at least one microelectronic element overlying the surface of the substrate;
joining a first metal wire to a first electrically conductive element of the electrically conductive elements, wherein:
a first end of the first metal wire is bonded to the first electrically conductive element;
a second end of the first metal wire is opposite to the first end of the first metal wire and extends away from the substrate; and
the second end of the first metal wire is displaced a distance in a horizontal direction relative to the first end of the first metal wire bonded to the first electrically conductive element;
joining a second metal wire to a second electrically conductive element of the electrically conductive elements, wherein:
a first end of the second metal wire is bonded to the second electrically conductive element; and
a second end of the second metal wire is opposite to the first end of the second metal wire and is touching at least one of the first or second electrically conductive elements;
joining a third metal wire to a third electrically conductive element of the electrically conductive elements, wherein:
a first end of the third metal wire is bonded to the third electrically conductive element;
a second end of the third metal wire is opposite to the first end of the third metal wire and extends away from the substrate; and
the second end of the third metal wire is displaced the distance in the horizontal direction relative to the first end of the third metal wire bonded to the third electrically conductive element;
forming an encapsulation layer above the surface of the substrate, wherein:
the encapsulation layer covers the first metal wire, the second metal wire, and the third metal wire; and
the first metal wire, the second metal wire, and the third metal wire are spaced from one another by the encapsulation layer;
removing a portion of the encapsulation layer to expose the second end of the first metal wire, wherein removing the portion of the encapsulation layer to expose the second end of the first metal wire comprises forming one or more cavities in the encapsulation layer so that the second end of the first metal wire is exposed above a bottom surface of the one or more cavities in the encapsulation layer; and
providing an electrically conductive material on the encapsulation layer in electrical connection with the second end of the first metal wire.
2 . The method of claim 1 , wherein the second metal wire is a loop.
3 . The method of claim 1 , wherein:
at least a portion of the second metal wire is parallel with the substrate; and
the at least the portion of the second metal wire is between the first end of the second metal wire and the second end of the second metal wire.
4 . The method of claim 1 , wherein the second end of the second metal wire is bonded to the second electrically conductive element.
5 . The method of claim 1 , wherein the second end of the second metal wire is bonded to the first electrically conductive element.
6 . The method of claim 1 , wherein:
the first metal wire comprises a first portion; and
removing the portion of the encapsulation layer to expose the second end of the first metal wire also exposes the first portion of the first metal wire.
7 . The method of claim 1 , wherein the encapsulation layer defines a first surface portion at a first height above the surface of the substrate in a first area and the removing of the portion of the encapsulation layer includes defining a second surface portion at a second height above the surface of the substrate in a second area.
8 . The method of claim 7 , wherein the second height is less than the first height.
9 . A method comprising:
providing a substrate having a surface having electrically conductive elements, wherein the electrically conductive elements comprise a first electrically conductive element and a second electrically conductive element;
disposing at least one microelectronic element overlying the surface of the substrate;
joining metal wires to the electrically conductive elements, wherein:
the metal wires comprise a first metal wire;
portions of the metal wires extend upward from the substrate;
the first wire of the metal wires has a first end, a first portion, and a second end; and
the first end of the first wire is joined to the first electrically conductive element;
forming an encapsulation layer above the surface of the substrate, wherein the encapsulation layer covers the metal wires, and the metal wires are spaced from one another by the encapsulation layer;
removing a portion of the encapsulation layer to expose the first portion of the first metal wire and the second end of the first metal wire, the removing including forming one or more cavities in the encapsulation layer so that the first portion and the second end of the first metal wire are exposed above a bottom surface of the one or more cavities in the encapsulation layer; and
providing an electrically conductive material on the encapsulation layer directly contacting the first portion of the first metal wire.
10 . The method of claim 9 , wherein the encapsulation layer defines a first surface portion at a first height above the surface of the substrate in a first area and the removing of the portion of the encapsulation layer includes defining a second surface portion at a second height above the surface of the substrate in a second area.
11 . The method of claim 10 , wherein the second height is less than the first height.
12 . The method of claim 9 , further comprising:
joining a second metal wire to a second electrically conductive element of the electrically conductive elements, wherein:
a first end of the second metal wire is bonded to the second electrically conductive element; and
a second end of the second metal wire is opposite to the first end of the second metal wire and is connected to at least one of the first or second electrically conductive elements.
13 . The method of claim 12 , wherein the second metal wire is a loop.
14 . The method of claim 12 , wherein:
at least a portion of the second metal wire is parallel with the substrate; and
the at least the portion of the second metal wire is between the first end of the second metal wire and the second end of the second metal wire.
15 . The method of claim 12 , wherein the second end of the second metal wire is bonded to the second electrically conductive element.
16 . The method of claim 12 , wherein the second end of the second metal wire is bonded to the first electrically conductive element.