Stacked semiconductor package and method for fabricating the same
A stacked semiconductor package having a unit package, cover substrates, adhesive members and connection electrodes is presented. The unit package includes a substrate, a first circuit pattern and a second circuit pattern. The first circuit pattern is disposed over an upper face of the substrate. The second circuit pattern is disposed over a lower face of the substrate. The lower and upper faces of the substrate oppose each other. The first and second semiconductor chips are respectively electrically connected to the first and second circuit patterns. The cover substrates are opposed to the first semiconductor chip and the second semiconductor chip. The adhesive members are respectively interposed between the unit package and the cover substrates. The connection electrodes pass through the unit package, the cover substrates and the adhesive members and are electrically connected to the first and second circuit patterns.
1. A semiconductor package, comprising:
a unit package comprising:
a substrate,
a first circuit pattern disposed over an upper face of the substrate,
a second circuit pattern disposed over a lower face of the substrate wherein the lower face is opposed to the upper face, and
first and second semiconductor chips respectively electrically connected to the first and second circuit patterns;
cover substrates opposed to the first semiconductor chip and the second semiconductor chip;
a unitary adhesive member being fully filled between the first and second circuit patterns and the first and second semiconductor chips and between the unit package and the cover substrate, respectively; and
connection electrodes passing through the unit package, the cover substrates and the adhesive members such that the connection electrodes electrically connect together the first and second circuit patterns.
2. The semiconductor package according to claim 1 , further comprising: a connection member electrically connected to an end portion of the connection electrode.
3. The semiconductor package according to claim 1 , wherein a number of the unit package is at least two, and one of the adhesive members is interposed between each adjacent unit package pair.
4. The semiconductor package according to claim 1 , wherein the adhesive member is selected from the group consisting of a thermosetting resin and a thermoplastic resin.
5. The semiconductor package according to claim 1 , further comprising: a third circuit pattern disposed over an inside face of the cover substrates and electrically connected to the connection electrodes; and a third semiconductor chip electrically connected to the third circuit pattern.