IP Library Assignment 067312/0596
Patent Assignment
Reel/Frame 067312/0596

Change of Name

Recorded: 2024-05-03 Pages: 5
Assignor
TESSERA, INC.
Executed: 2021-10-01
Assignee
TESSERA LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Package-On-Package Assembly with Wire Bonds to Encapsulation Surface
Application: 18/380,053 →
Publication: US 2024/0203930
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2024
From: SATO, HIROAKI; KANG, TECK-GYU; HABA, BELGACEM; OSBORN, PHILIP R.
To: TESSERA, INC.
Reel/Frame 067312/0264 →
Change of Name May 3, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 067312/0605 →