Patent Assignment
Reel/Frame 067389/0118
Assignment of Assignor's Interest
Recorded: 2024-05-13
Pages: 3
Assignors
MANDALAPU, CHANDRASEKHAR
Executed: 2021-09-17
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2021-08-09
GAO, GUILIAN
Executed: 2021-09-16
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Dbi to Si Bonding for Simplified Handle Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
May 13, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 067397/0224 →
Security Interest
May 28, 2025
From: ADEIA INC. (F/K/A XPERI HOLDING CORPORATION); ADEIA HOLDINGS INC.; ADEIA MEDIA HOLDINGS INC.; ADEIA IMAGING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 071454/0343 →