IP Library › Assignment 067397/0224
Patent Assignment
Reel/Frame 067397/0224

Change of Name

Recorded: 2024-05-13 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Dbi to Si Bonding for Simplified Handle Wafer
Application: 18/653,243 →
Publication: US 2024/0282747
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 13, 2024
From: MANDALAPU, CHANDRASEKHAR; FOUNTAIN, GAIUS GILLMAN, JR.; GAO, GUILIAN
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 067389/0118 →
Security Interest May 28, 2025
From: ADEIA INC. (F/K/A XPERI HOLDING CORPORATION); ADEIA HOLDINGS INC.; ADEIA MEDIA HOLDINGS INC.; ADEIA IMAGING LLC
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 071454/0343 →