Patent Assignment
Reel/Frame 067553/0352
Corrective Assignment to Correct the Conveying Party Data from Stats Chippac Pte. Lte. to Stats Chippac Ltd. and Correct the Name of Receiving Party Data from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded at Reel: 64838 Frame: 948. Assignor(S) Hereby Confirms the Change of Name.
Recorded: 2024-05-22
Pages: 11
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Property
(1)
Semiconductor Package System with Thermal Die Bonding
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 14, 2006
From: LEE, SANGKWON; LEE, TAE KEUN
To: STATS CHIPPAC LTD.
Reel/Frame 017168/0492 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0328 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052935/0327 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 038378 Frame: 0328
Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 064838/0948 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →