IP Library Assignment 067567/0324
Patent Assignment
Reel/Frame 067567/0324

Corrective Assignment to Correct the the Receiving Party Name Previously Recorded at Reel: 38378 Frame: 427. Assignor(S) Hereby Confirms the Assignee.

Recorded: 2024-05-30 Pages: 10
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Property (1)
Semiconductor Device and Method of Forming Flipchip Interconnect Structure
Application: 12/947,414 →
Publication: US 2011/0074022
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0427 →
Release of Security Interest Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →