Patent Assignment
Reel/Frame 067567/0427
Corrective Assignment to Correct the Conveying Party Data from Stats Ghippac Pte. Lte. to Stats Chippac Ltd. and Corect the Name of Receiving Party Data from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. Previously Recorded at Reel: 64838 Frame: 948. Assignor(S) Hereby Confirms the Change of Name.
Recorded: 2024-05-30
Pages: 11
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SINGAPORE
Covered Properties
(2)
Flip Chip Interconnection
Integrated Circuit Packaging System with Stacked Device and Method of Manufacture Thereof
Patent:
7,691,674 →
Application:
12/488,557 →
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 15, 2006
From: PENDSE, RAJENDRA D.; KARNEZOS, MARCOS; KIM, KYUNG-MOON; LEE, KOO HONG
To: STATS CHIPPAC LTD.
Reel/Frame 018263/0355 →
Assignment of Assignor's Interest
Jul 8, 2009
From: BATHAN, HENRY DESCALZO; CAMACHO, ZIGMUND RAMIREZ; PISIGAN, JAIRUS LEGASPI
To: STATS CHIPPAC LTD.
Reel/Frame 022929/0899 →
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Change of Name
Apr 7, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 038378/0328 →
Release of Security Interest
Jun 15, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 052935/0327 →
Correct Error in Assignment Name from Stats Chippac Pte. Lte. to Stats Chippac Pte. Ltd. (Reel: 038378 Frame: 0328
Aug 30, 2023
From: STATS CHIPPAC PTE. LTE.
To: STATS CHIPPAC PTE. LTE.
Reel/Frame 064838/0948 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →