Patent Assignment
Reel/Frame 067701/0158
Assignment of Assignor's Interest
Recorded: 2024-06-12
Pages: 6
Assignors
ZHANG, YUANHENG
Executed: 2024-06-05
MONG, DEREK
Executed: 2024-06-05
BHAGATH, SHRIKAR
Executed: 2024-06-10
YU, FEN
Executed: 2024-06-05
QU, PAUL
Executed: 2024-06-06
DONG, SHAOPENG
Executed: 2024-06-11
GUO, RUI
Executed: 2024-06-11
LOEH, JIUN DONG
Executed: 2024-06-05
TANG, JERRY
Executed: 2024-06-05
ZHOU, ZENGYU
Executed: 2024-06-05
Assignee
SANDISK TECHNOLOGIES LLC
7501 N CAPITAL OF TEXAS HWY, BUILDING A, SUITE #100, AUSTIN, TEXAS, 78731
Covered Property
(1)
Semiconductor Device Including an Integrated Wafer Level Heat Sink Window Plate
Application:
18/740,674 →
Publication:
US 2025/0385152
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →