Patent Assignment
Reel/Frame 067958/0190
CORRECTIVE ASSIGNMENT TO CORRECT THE THE NAME OF CONVEYING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC LTD. AND CORRECT THE NAME OF RECEIVING PARTY DATA FROM STATS CHIPPAC PTE. LTE. TO STATS CHIPPAC PTE. LTD. PREVIOUSLY RECORDED AT REEL: 64838 FRAME: 948. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Recorded: 2024-05-30
Received: 2024-07-11
Pages: 11
Assignor
STATS CHIPPAC LTD.
Executed: 2016-03-29
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, SGX, SINGAPORE
Covered Applications
(10)
OPTICAL DIE-DOWN QUAD FLAT NON-LEADED PACKAGE
App. No. 12/353,489
→
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING STACKED DIE
App. No. 12/235,521
→
METHOD OF FABRICATING MODULE HAVING STACKED CHIP SCALE SEMICONDUCTOR PACKAGES
App. No. 12/125,770
→
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF MANUFACTURE THEREFOR
App. No. 12/045,606
→
MICRO CHIP-SCALE-PACKAGE SYSTEM
App. No. 11/869,737
→
STACKED DIE PACKAGE SYSTEM
App. No. 11/844,354
→
STACKED SEMICONDUCTOR PACKAGES AND METHOD THEREFOR
App. No. 11/760,712
→
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING SHIELD
App. No. 11/419,748
→
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME SUBSTRATE
App. No. 11/163,561
→
SEMICONDUCTOR SYSTEM WITH FINE PITCH LEAD FINGERS
App. No. 11/162,617
→