Stacked semiconductor packages and method therefor
View Patent ↗A stackable semiconductor package and method includes providing a first semiconductor package having a first plurality of lower leads and a first plurality of upper leads. A second semiconductor package having a second plurality of lower leads is provided. The second plurality of lower leads is attached to the first plurality of upper leads to form a stack of semiconductor packages.
1. A method of stacking semiconductor packages comprising:
providing a first semiconductor package having a first plurality of upper leads and a first wrap around a die pad;
providing a second semiconductor package having a second plurality of lower leads and a second wrap around the die pad; and
attaching the plurality of lower leads to the first plurality of upper leads and the first wrap attached to the second wrap.
2. The method of stacking semiconductor packages as claimed in claim 1 , wherein:
providing a first semiconductor package provides a first plurality of lower leads on opposing edges of the first semiconductor package and provides a second plurality of upper leads on opposing edges of the first semiconductor package.
3. The method of stacking semiconductor packages as claimed in claim 1 , wherein:
providing a first semiconductor package having a first plurality of upper leads provides at least one of gull-wing leads, J-bent leads, terminal pads, wrap around die pads, and combinations thereof.
4. The method of stacking semiconductor packages as claimed in claim 1 , wherein:
providing a second semiconductor package having the plurality of lower leads provides at least one of gull-wing leads, J-bent leads, terminal pads, and combinations thereof.
5. A method of manufacturing a stackable semiconductor package comprising:
providing a die pad;
attaching a die to the die pad;
providing a plurality of lower leads adjacent opposing sides of the die pad;
providing a plurality of upper leads adjacent alternate opposing sides of the die pad and a widened lead tip;
wire bonding the die to the die pad, the plurality of lower leads, and the plurality of upper leads; and
encapsulating the die to expose a portion of the plurality of lower leads and a portion of the plurality of upper leads.
6. The method of manufacturing a stackable semiconductor package as claimed in claim 5 , wherein:
providing a plurality of upper leads provides at least one of gull-wing leads, J-bent leads, terminal pads, wrap around die pads, and combinations thereof.
7. The method of manufacturing a stackable semiconductor package as claimed in claim 5 , wherein:
providing a plurality of lower leads provides at least one of gull-wing leads, J-bent leads, terminal pads, and combinations thereof.
8. A stack of semiconductor packages comprising:
a first semiconductor package having a first plurality of upper leads and a first wrap around a die pad; and
a second semiconductor package having a plurality of lower leads attached to the first plurality of upper leads and a second wrap around the die pad, the second wrap attached to the first wrap.
9. The stack of semiconductor packages as claimed in claim 8 , wherein:
the first semiconductor package comprises a first plurality of lower leads on opposing edges of the first semiconductor package and a second plurality of upper leads on opposing edges of the first semiconductor package.
10. The stack of semiconductor packages as claimed in claim 8 , wherein:
the first semiconductor package having a first plurality of upper leads comprises at least one of gull-wing leads, J-bent leads, terminal pads, wrap around die pads, and combinations thereof.
11. The stack of semiconductor packages as claimed in claim 8 , wherein:
the second semiconductor package having the plurality of lower leads comprises at least one of gull-wing leads, J-bent leads, terminal pads, and combinations thereof.
12. A stackable semiconductor package comprising:
a die pad;
a die attached to the die pad;
a plurality of lower leads adjacent opposing sides of the die pad;
a plurality of upper leads adjacent alternate opposing sides of the die pad and a widened lead tip;
wires bonding the die to the die pad, the plurality of lower leads, and the plurality of upper leads; and
an encapsulant to expose a portion of the plurality of lower leads and a portion of the plurality of upper leads.
13. The stackable semiconductor package as claimed in claim 12 , wherein:
the plurality of upper leads comprises at least one of gull-wing leads, J-bent leads, terminal pads, wrap around die pads, and combinations thereof.
14. The stackable semiconductor package as claimed in claim 12 , wherein:
the plurality of lower leads comprises at least one of gull-wing leads, J-bent leads, terminal pads, and combinations thereof.
15. A method of manufacturing a stackable semiconductor package comprising:
providing a die pad;
attaching a die to the die pad;
providing a plurality of lower leads adjacent opposing sides of the die pad;
providing a plurality of upper leads adjacent alternate opposing sides of the die pad;
wire bonding the die to the die pad, the plurality of lower leads, and the plurality of upper leads; and
encapsulating the die to expose a portion of the plurality of lower leads and a portion of the plurality of upper leads wherein providing a plurality of upper leads provides a plated lead tip.
16. The method of manufacturing a stackable semiconductor package as claimed in claim 15 wherein providing a plurality of upper leads:
provides at least one of gull-wing leads, J-bent leads, terminal pads, wrap around die pads, and combinations thereof.
17. The method of manufacturing a stackable semiconductor package as claimed in claim 15 wherein providing a plurality of lower leads:
provides at least one of gull-wing leads, J-bent leads, terminal pads, and combinations thereof.
18. A stackable semiconductor package comprising:
a die pad;
a die attached to the die pad;
a plurality of lower leads adjacent opposing sides of the die pad;
a plurality of upper leads adjacent alternate opposing sides of the die pad having plated lead tips;
wires bonding the die to the die pad, the plurality of lower leads, and the plurality of upper leads; and
an encapsulant to expose a portion of the plurality of lower leads and a portion of the plurality of upper leads.
19. The stackable semiconductor package as claimed in claim 18 , wherein the plurality of upper leads comprises:
at least one of gull-wing leads, J-bent leads, terminal pads, wrap around die pads, and combinations thereof.
20. The stackable semiconductor package as claimed in claim 18 , wherein the plurality of lower leads comprises:
at least one of gull-wing leads, J-bent leads, terminal pads, and combinations thereof.