Stacked die package system

1. A method of manufacture of a stacked die package system comprising:

forming a bottom package including a bottom substrate and a bottom die mounted and electrically connected under the bottom substrate with wires;

forming a top package including a top substrate and a top die mounted and electrically connected over the top substrate;

mounting the top package by the top substrate over the bottom substrate;

electrically connecting the bottom and top substrates with wires; and

mounting system electrical connectors under the bottom substrate adjacent the bottom die.

2. The method as claimed in claim 1 further comprising:

mounting and electrically connecting a topside die to the bottom substrate between the bottom and top substrates.

3. The method as claimed in claim 1 further comprising:

testing the bottom package; and

testing the top package.

4. A method of manufacture of a stacked die package system comprising:

forming a bottom package including a bottom substrate and a bottom die, the bottom die mounted and having wires for electrical connection under the bottom substrate;

encapsulating the bottom die, the wires therefor, or a combination thereof;

forming a top package including a top substrate and a top die, the top die mounted and having electrical connectors for electrical connection over the top substrate;

encapsulating the top die, the electrical connectors therefor, or a combination thereof;

mounting the top package using the top substrate over the bottom substrate;

electrically connecting the bottom and top substrates with substrate electrical connectors;

encapsulating the top package; and

mounting system electrical connectors under the bottom substrate around the die of the bottom package.

5. The method as claimed in claim 4 further comprising:

mounting and electrically connecting a topside die to the bottom substrate between the bottom and top substrates; and

encapsulating the topside die or electrical connectors therefor.

6. The method as claimed in claim 4 further comprising:

testing the bottom package; and

testing the top die package separately from the bottom package.

7. A stacked die package system comprising:

a bottom package including a bottom substrate and a bottom die mounted under the bottom substrate and electrically connected with wires;

a topside package including a top substrate and a die mounted over the top substrate, the topside package mounted by the top substrate over the bottom substrate;

wire connectors from the top substrate to the bottom substrate; and

system electrical connectors mounted on the bottom of the bottom substrate adjacent the die mounted under the bottom substrate.

8. The system as claimed in claim 7 further comprising:

a topside die mounted between the bottom and top substrates.

9. The system as claimed in claim 7 further comprising:

epoxy dots disposed between the bottom package and the top package.

10. The system as claimed in claim 7 further comprising:

a top die mounted over the topside package; and

electrical connectors from the top die to the bottom substrate.

11. A stacked die package system comprising:

a bottom package including a bottom substrate and an encapsulated bottom die mounted under the bottom substrate and electrically connected with wires;

a topside package including a top substrate and an encapsulated top die mounted over the top substrate, the topside package mounted by the top substrate over the bottom substrate;

wire connectors from the topside package to the bottom substrate; and

system electrical connectors mounted on the bottom of the bottom substrate around the encapsulated bottom die.

12. The system as claimed in claim 11 further comprising:

a topside die mounted between the bottom and top substrates; and

electrical connectors electrically connecting the topside die to the bottom substrate.

13. The system as claimed in claim 11 further comprising:

epoxy dots disposed between the bottom and top substrates.

14. The system as claimed in claim 11 further comprising:

a top die mounted over the topside package;

electrical connectors from the top die to the bottom substrate; and

an encapsulant over the top die and the electrical connectors from the top die to the bottom substrate.