Patent Assignment
Reel/Frame 068276/0587
Assignment of Assignor's Interest
Recorded: 2024-08-14
Pages: 14
Assignors
SHI, LEI
Executed: 2024-07-26
JIANG, WEITING
Executed: 2024-07-26
ZHANG, CONG
Executed: 2024-07-29
CHEN, CHIEN TE
Executed: 2024-08-06
YU, CHIANG CHUNG
Executed: 2024-08-12
HSU, CHING WEI
Executed: 2024-08-06
LIU, YANGMING
Executed: 2024-07-26
ZHENG, CHAOLUN
Executed: 2024-07-29
BAI, YE
Executed: 2024-07-26
PATHAK, NIRBHAYA
Executed: 2024-08-12
Assignee
SANDISK TECHNOLOGIES, INC.
951 SANDISK DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Semiconductor Package Having Bifacial Semiconductor Wafers
Application:
18/803,091 →
Publication:
US 2026/0052708
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement (Supplemental)
Nov 14, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 069411/0486 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →