Patent Assignment
Reel/Frame 068302/0563
Assignment of Assignor's Interest
Recorded: 2024-08-15
Pages: 12
Assignors
LIANG, MINGHAO
Executed: 2024-08-06
WANG, PENG
Executed: 2024-08-12
KANG, ZHAOMING
Executed: 2024-08-06
ZHAI, BO
Executed: 2024-08-12
XUE, DONGPENG
Executed: 2024-08-06
ZHANG, HUIRONG
Executed: 2024-08-06
MONG, WENG KHOON
Executed: 2024-08-06
ZHU, RONGKANG
Executed: 2024-08-07
Assignee
SANDISK TECHNOLOGIES, INC.
951 SANDISK DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Non-Contact Semiconductor Die Singulation Process
Application:
18/806,220 →
Publication:
US 2026/0052926
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement (Supplemental)
Nov 14, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 069411/0486 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →