Patent Assignment
Reel/Frame 068367/0596
Assignment of Assignor's Interest
Recorded: 2024-08-22
Pages: 3
Assignor
TAN, CHUAN SENG
Executed: 2024-08-21
Assignee
NANYANG TECHNOLOGICAL UNIVERSITY
50 NANYANG AVENUE, SINGAPORE, 639798, SINGAPORE
Covered Property
(1)
Selective Dielectric Capping for Hybrid Bonding
Application:
18/809,472 →
Publication:
US 2025/0149474
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 22, 2024
From: LIANTO, PRAYUDI
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 068367/0746 →
Assignment of Assignor's Interest
Oct 15, 2024
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 068892/0801 →