Patent Assignment
Reel/Frame 068367/0746
Assignment of Assignor's Interest
Recorded: 2024-08-22
Pages: 3
Assignor
LIANTO, PRAYUDI
Executed: 2024-08-20
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Selective Dielectric Capping for Hybrid Bonding
Application:
18/809,472 →
Publication:
US 2025/0149474
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.