IP Library › Assignment 068892/0801
Patent Assignment
Reel/Frame 068892/0801

Assignment of Assignor's Interest

Recorded: 2024-10-15 Pages: 5
Assignor
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (4)
Selective Dielectric Capping for Hybrid Bonding
Application: 18/809,472 →
Publication: US 2025/0149474
Heated Process Kit for Substrate Processing
Application: 18/745,494 →
Title Not Available
Application: 18/770,602 →
Title Not Available
Application: 18/771,966 →
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 8, 2024
From: AGARWAL, PRASHANT; ZHANG, KANG; JUPUDI, ANANTHKRISHNA; BABU, SARATH
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 067924/0964 →
Assignment of Assignor's Interest Jul 25, 2024
From: BABU, SARATH; JUPUDI, ANANTHKRISHNA
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 068081/0288 →
Assignment of Assignor's Interest Jul 25, 2024
From: SUNDARARAJAN, MUKUND; TSAI, CHENG-HSIUNG MATTHEW; LAVAN, SHANE
To: APPLIED MATERIALS, INC.
Reel/Frame 068081/0166 →
Assignment of Assignor's Interest Aug 13, 2024
From: HUNG, RAYMOND
To: APPLIED MATERIALS, INC.
Reel/Frame 068262/0404 →
Assignment of Assignor's Interest Aug 13, 2024
From: BALAKRISHNAN, KARTHIK NARAYANAN; JUPUDI, ANANTHKRISHNA; MEHTA, GAURAV
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 068262/0265 →
Assignment of Assignor's Interest Aug 22, 2024
From: TAN, CHUAN SENG
To: NANYANG TECHNOLOGICAL UNIVERSITY
Reel/Frame 068367/0596 →
Assignment of Assignor's Interest Aug 22, 2024
From: LIANTO, PRAYUDI
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 068367/0746 →