Patent Assignment
Reel/Frame 068405/0928
Change of Name
Recorded: 2024-08-27
Pages: 21
Assignor
RESONAC CORPORATION
Executed: 2024-07-12
Assignee
RESONAC HARD DISK CORPORATION
5-1, YAWATA KAIGAN DORI, ICHIHARA-SHI, CHIBA, 290-0067, JAPAN
Covered Properties
(5)
Dummy Substrate and Manufacturing Method Thereof
Application:
17/410,589 →
Publication:
US 2022/0068304
Dummy Substrate and Manufacturing Method Thereof
Recording and Reproducing Device
Application:
18/241,463 →
Publication:
US 2024/0079033
Recording and Reproducing Device with Medium Regulating Portion
Recording and Reproducing Device
Application:
18/461,082 →
Publication:
US 2024/0079034
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 24, 2021
From: KAKITA, SUNAO; KUSHINO, TAKAHIRO; INADA, HIDENORI
To: SHOWA DENKO K.K.
Reel/Frame 057274/0502 →
Change of Name
Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
Assignment of Assignor's Interest
Sep 1, 2023
From: OOHASHI, FUMINOBU
To: RESONAC CORPORATION
Reel/Frame 064776/0026 →
Assignment of Assignor's Interest
Sep 5, 2023
From: OOHASHI, FUMINOBU
To: RESONAC CORPORATION
Reel/Frame 064796/0879 →
Assignment of Assignor's Interest
Sep 5, 2023
From: OOHASHI, FUMINOBU
To: RESONAC CORPORATION
Reel/Frame 064797/0670 →
Change of Name
Nov 15, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 065593/0496 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →