IP Library Assignment 068530/0950
Patent Assignment
Reel/Frame 068530/0950

License

Recorded: 2024-09-09 Pages: 6
Assignor
MICRON TECHNOLOGY, INC.
Executed: 2023-03-23
Assignee
LODESTAR LICENSING GROUP LLC
1603 ORRINGTON AVENUE, SUITE 600, EVANSTON, ILLINOIS, 60201
Covered Properties (5)
Methods of Fabricating Semiconductor Structures
Patent: 9,275,909 →
Application: 13/964,282 →
Publication: US 2015/0041879
Semiconductor Structures Including Dielectric Materials Having Differing Removal Rates
Application: 15/013,298 →
Publication: US 2016/0148949
Semiconductor Structures Including Dielectric Materials Having Differing Removal Rates
Application: 16/052,123 →
Publication: US 2018/0337195
Semiconductor Devices Including Stack Oxide Materials Having Different Densities or Different Oxide Portions, and Semiconductor Devices Including Stack Dielectric Materials Having Different Portions
Application: 17/366,471 →
Publication: US 2021/0335815
Apparatuses Including Insulative Structures of Stack Structures Having Different Portions and Related Memory Devices
Application: 18/409,679 →
Publication: US 2024/0196614
Related Assignments (12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 12, 2013
From: JAYANTI, SRIKANT; SIMSEK-EGE, FATMA ARZUM; AELLA, PAVAN KUMAR REDDY
To: MICRON TECHNOLOGY, INC.
Reel/Frame 030987/0830 →
Security Interest May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Patent Security Agreement Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
Corrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest. Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
Supplement No. 1 to Patent Security Agreement Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A.., AS COLLATERAL AGENT
Reel/Frame 047630/0756 →
Supplement No. 10 to Patent Security Agreement Nov 13, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048102/0420 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
Release of Security Interest Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050719/0550 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
Release of Security Interest Nov 14, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051028/0835 →