Patent Assignment
Reel/Frame 069096/0015
Assignment of Assignor's Interest
Recorded: 2024-10-31
Pages: 4
Assignors
ZHU, RUOGU MATTHEW
Executed: 2024-07-02
MATSUNO, KOICHI
Executed: 2024-07-02
YU, JIXIN
Executed: 2024-07-03
ALSMEIER, JOHANN
Executed: 2024-07-02
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property
(1)
Three-Dimensional Memory Device with Through-Stack Contact via Structures and Methods for Forming the Same
Application:
18/763,704 →
Publication:
US 2026/0013125
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Collateral Agreement
Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
Assignment of Assignor's Interest
Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement
Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests
Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →