Patent Assignment
Reel/Frame 069128/0309
Assignment of Assignor's Interest
Recorded: 2024-11-04
Pages: 3
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Wafer-Level Bonding of Obstructive Elements
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.