IP Library › Assignment 069301/0877
Patent Assignment
Reel/Frame 069301/0877

Change of Name

Recorded: 2024-11-04 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Wafer-Level Bonding of Obstructive Elements
Application: 18/346,396 →
Publication: US 2024/0079351
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 4, 2024
From: DELACRUZ, JAVIER A.; KATKAR, RAJESH
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 069128/0309 →