IP Library › Assignment 070281/0726
Patent Assignment
Reel/Frame 070281/0726

Assignment of Assignor's Interest

Recorded: 2025-02-20 Pages: 4
Assignors
GAO, GUILIAN
Executed: 2019-09-17
UZOH, CYPRIAN EMEKA
Executed: 2019-09-18
THEIL, JEREMY ALFRED
Executed: 2019-09-17
HABA, BELGACEM
Executed: 2019-09-23
KATKAR, RAJESH
Executed: 2019-09-17
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Molded Direct Bonded and Interconnected Stack
Application: 18/513,431 →
Publication: US 2024/0243103
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Feb 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 070287/0837 →