IP Library › Assignment 070287/0837
Patent Assignment
Reel/Frame 070287/0837

Change of Name

Recorded: 2025-02-20 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Molded Direct Bonded and Interconnected Stack
Application: 18/513,431 →
Publication: US 2024/0243103
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 20, 2025
From: GAO, GUILIAN; UZOH, CYPRIAN EMEKA; THEIL, JEREMY ALFRED; HABA, BELGACEM
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 070281/0726 →