Patent Assignment
Reel/Frame 070370/0101
Assignment of Assignor's Interest
Recorded: 2025-02-28
Pages: 3
Assignors
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2020-07-14
MANDALAPU, CHANDRASEKHAR
Executed: 2020-07-20
UZOH, CYPRIAN EMEKA
Executed: 2020-07-13
THEIL, JEREMY ALFRED
Executed: 2020-07-13
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Direct Hybrid Bonding of Substrates Having Microelectronic Components with Different Profiles and/or Pitches at the Bonding Interface
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name
Feb 28, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 070370/0194 →