IP Library › Assignment 070370/0194
Patent Assignment
Reel/Frame 070370/0194

Change of Name

Recorded: 2025-02-28 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Direct Hybrid Bonding of Substrates Having Microelectronic Components with Different Profiles and/or Pitches at the Bonding Interface
Application: 18/067,617 →
Publication: US 2023/0268308
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Assignment of Assignor's Interest Feb 28, 2025
From: FOUNTAIN, GAIUS GILLMAN, JR.; MANDALAPU, CHANDRASEKHAR; UZOH, CYPRIAN EMEKA; THEIL, JEREMY ALFRED
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 070370/0101 →