Patent Assignment
Reel/Frame 072123/0035
Assignment of Assignor's Interest
Recorded: 2025-08-26
Pages: 4
Assignor
LOH, HUNG MENG
Executed: 2024-08-29
Assignee
STMICROELECTONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Laminate Package Lid to Prevent Delamination
Application:
19/297,436 →
Publication:
US 2026/0068744
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 26, 2025
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 072123/0132 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 72123 Frame: 35. Assignor(S) Hereby Confirms the Assignment.
Sep 4, 2025
From: LOH, HUNG MENG
To: STMICROELECTRONICS PTE LTD
Reel/Frame 072818/0029 →