Patent Assignment
Reel/Frame 072123/0132
Assignment of Assignor's Interest
Recorded: 2025-08-26
Pages: 5
Assignor
STMICROELECTRONICS PTE LTD
Executed: 2024-10-07
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Property
(1)
Laminate Package Lid to Prevent Delamination
Application:
19/297,436 →
Publication:
US 2026/0068744
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 26, 2025
From: LOH, HUNG MENG
To: STMICROELECTONICS PTE LTD
Reel/Frame 072123/0035 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 72123 Frame: 35. Assignor(S) Hereby Confirms the Assignment.
Sep 4, 2025
From: LOH, HUNG MENG
To: STMICROELECTRONICS PTE LTD
Reel/Frame 072818/0029 →