Patent Assignment
Reel/Frame 072818/0029
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 72123 Frame: 35. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2025-09-04
Pages: 7
Assignor
LOH, HUNG MENG
Executed: 2024-08-29
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Laminate Package Lid to Prevent Delamination
Application:
19/297,436 →
Publication:
US 2026/0068744
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.