Patent Assignment
Reel/Frame 073979/0143
Assignment of Assignor's Interest
Recorded: 2026-03-05
Pages: 7
Assignors
CHEN, S.L.
Executed: 2018-04-27
YEN, CHEN-HSUAN
Executed: 2018-04-27
LO, HAN-TANG
Executed: 2018-09-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties
(2)
Structures and Methods for Heat Dissipation of Semiconductor Devices
Structures and Methods for Heat Dissipation of Semiconductor Devices
Patent:
11,658,088 →
Application:
17/156,164 →