Assignment of Assignor's Interest

Recorded: 2026-04-02 Pages: 8

Assignors

CHEN, WEI

Executed: 2025-08-19

MA, WEICE

Executed: 2025-08-20

YING, XIAOYUAN

Executed: 2025-08-19

Assignee

HUAWEI TECHNOLOGIES CO., LTD.

HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, 518129, CHINA

Covered Property (1)

Heat Dissipation Apparatus, Circuit Module, Electronic Device, and Circuit Module Assembly Method

Application: 18/389,923 →

Publication: US 2024/0121881

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.