Heat dissipation apparatus, circuit module, electronic device, and circuit module assembly method
In a dissipation apparatus, a support is mounted to a circuit board, and an assembly opening on a bearing portion in the support is configured to accommodate a heat source on the circuit board. A heat sink is disposed on the bearing portion of the support, and a heat conducting surface of the heat sink can penetrate the assembly opening, to be attached to the heat conducting surface of the heat source. A peak-valley structure in an elastic component is disposed on a mounting surface of the heat sink as a force-applying portion, and two ends of the elastic component exceed an edge of the heat sink and are mounted to the support as mounting portions. At least one elastic component can provide, to the heat sink by using the peak-valley structure, pressure to tightly attach the heat sink to the heat source.
1 . A heat dissipation apparatus configured to be used for a circuit board having a heat source, to dissipate heat from the heat source, wherein the heat dissipation apparatus comprises:
a support, wherein the support comprises a bearing portion provided with an assembly opening, and the bearing portion is configured to be fastened to the circuit board;
a heat sink, wherein the heat sink comprises a first heat conducting surface and a mounting surface that are opposite to each other, the heat sink is disposed on the bearing portion, and the first heat conducting surface faces the bearing portion and is configured to penetrate the assembly opening to be attached to a second heat conducting surface of the heat source; and
at least one elastic component, wherein the at least one elastic component is strip-shaped and has a peak-valley structure, the peak-valley structure of the at least one elastic component is disposed on the mounting surface of the heat sink, and two ends of the at least one elastic component are separately fastened to the support;
the at least one elastic component is configured to provide, to the heat sink, pressure to attach the heat sink to the heat source; and
wherein contact regions between the at least one elastic component and the mounting surface of the heat sink are located at edge positions in an orthographic projection region of the second beat conducting surface of the beat source on the mounting surface of the beat sink.
2 . The heat dissipation apparatus according to claim 1 , wherein the peak-valley structure of the at least one elastic component elastically abuts against the mounting surface of the heat sink, and the heat sink is elastically bound to the support.
3 . The heat dissipation apparatus according to claim 1 , wherein the two ends of the at least one elastic component are detachably connected to the support.
4 . The heat dissipation apparatus according to claim 3 , wherein the two ends of the at least one elastic component separately comprise a hooking portion extending toward the support;
two mounting ends located on two sides of the heat sink are disposed on the support, and mounting holes adapted to the hooking portions are respectively disposed at the two mounting ends; and
the hooking portions at the two ends of the at least one elastic component are respectively clamped into the mounting holes at the two mounting ends.
5 . The heat dissipation apparatus according to claim 4 , wherein the heat sink further comprises a heat dissipation structure, and the heat dissipation structure is disposed on a side away from the first heat conducting surface; and
the heat dissipation structure comprises a plurality of fins arranged in parallel, a plurality of air ducts are formed between the plurality of fins, and the at least one elastic component correspondingly penetrates an air duct of the plurality of air ducts.
6 . The heat dissipation apparatus according to claim 5 , wherein a length direction of the at least one elastic component is parallel to an extension direction of the air duct that the at least one elastic component penetrates.
7 . The heat dissipation apparatus according to claim 5 , wherein a fluctuation shape of the peak-valley structure of the at least one elastic component is on a same plane.
8 . The heat dissipation apparatus according to claim 5 , wherein a thickness range of the at least one elastic component ranges from 1.5 mm to 10 mm, and a thickness direction is a direction perpendicular to a fluctuation shape of the peak-valley structure.
9 . The heat dissipation apparatus according to claim 1 , wherein a portion that is of the at least one elastic component and that is configured to press against the heat sink is in a dot shape or a linear shape.
10 . The heat dissipation apparatus according to claim 1 , wherein the at least one elastic component comprises two elastic components, and when a es-fitting-portion that is of each of the two elastic components and that is configured to press against the heat sink is in a dot shape, the portions between the two elastic components are not on a straight line.
11 . The heat dissipation apparatus according to claim 1 , wherein the at least one elastic component is symmetrically distributed relative to a center line of the at least one elastic component, and the center line is a straight line that passes through a midpoint of the at least one elastic component and that is perpendicular to a length direction of the at least one elastic component.
12 . A heat dissipation apparatus configured to be used for a circuit board having a heat source, to dissipate heat from the heat source, wherein the heat dissipation apparatus comprises:
a support, wherein the support comprises a bearing portion provided with an assembly opening, and the bearing portion is configured to be fastened to the circuit board;
a heat sink, wherein the heat sink comprises a first heat conducting surface and a mounting surface that are opposite to each other, the heat sink is disposed on the bearing portion, and the first beat conducting surface faces the bearing portion and is configured to penetrate the assembly opening to be attached to a second heat conducting surface of the heat source; and
at least one elastic component, wherein the at least one elastic component is strip-shaped and bas a peak-valley structure, the peak-valley structure of the at least one elastic component is disposed on the mounting surface of the heat sink, and two ends of the at least one elastic component are separately fastened to the support;
the at least one elastic component is configured to provide, to the heat sink pressure to attach the heat sink to the heat source;
wherein the two ends of the at least one elastic component are detachably connected to the support;
wherein the two ends of the at least one elastic component separately comprise a hooking portion extending toward the support;
two mounting ends located on two sides of the heat sink are disposed on the support, and mounting holes adapted to the hooking portions are respectively disposed at the two mounting ends; and
the hooking portions at the two ends of the at least one elastic component are respectively clamped into the mounting holes at the two mounting ends;
wherein the heat sink further comprises a heat dissipation structure, and the beat dissipation structure is disposed on a side away from the first heat conducting surface; and
the heat dissipation structure comprises a plurality of fins arranged in parallel a plurality of air ducts are formed between the plurality of fins, and the at least one elastic component correspondingly penetrates an air duct of the plurality of air ducts;
wherein the support further comprises:
a position-limiting portion, wherein the position-limiting portion is disposed on the bearing portion, and forms, together with the bearing portion, accommodating space for accommodating the heat sink, and the position-limiting portion is disposed around an outer edge of the heat sink,
a position-avoiding notch is disposed on the outer edge of the heat sink;
at least one of the two twee mounting ends is formed at a joint between the bearing portion and the position-limiting portion; and
the two ends of the at least one elastic component penetrate the position-avoiding notch, and are clamped into the mounting holes.
13 . The heat dissipation apparatus according to claim 12 , wherein an avoidance notch is disposed on a fin located at the position-avoiding notch, and the avoidance notch and the position-avoiding notch together form mounting space for mounting the two ends of the at least one elastic component to the mounting holes.
14 . The heat dissipation apparatus according to claim 12 , wherein the support further comprises an elevating portion, the elevating portion protrudes from the position-limiting portion in a direction away from the bearing portion, and the elevating portion is configured to limit the heat sink from being detached from the support.
15 . The heat dissipation apparatus according to claim 14 , wherein the elevating portion protrudes from the position-limiting portion forming the at least one of the two mounting ends in a direction away from the at least one of the two mounting ends.
16 . The heat dissipation apparatus according to claim 12 , wherein a surface facing the accommodating space on the position-limiting portion is a first guiding surface, a second guiding surface adapted to the first guiding surface is disposed at the two ends of the at least one elastic component, and the first guiding surface cooperates with the second guiding surface, to guide the two ends of the at least one elastic component into directions of the mounting holes.
17 . An electronic device comprising:
a circuit module comprising a heat dissipation apparatus, a circuit board, and an electronic component mounted to the circuit board, wherein:
the electronic component is a heat source;
the heat dissipation apparatus is configured to dissipate heat from the heat source, the heat dissipation apparatus comprises:
a support, wherein the support comprises a bearing portion provided with an assembly opening, and the bearing portion is configured to be fastened to the circuit board;
a heat sink, wherein the heat sink comprises a first heat conducting surface and a mounting surface that are opposite to each other, the heat sink is disposed on the bearing portion, and the first heat conducting surface faces the bearing portion and is configured to penetrate the assembly opening to be attached to a second heat conducting surface of the heat source; and
at least one elastic component, wherein the at least one elastic component is strip-shaped and has a peak-valley structure, the peak-valley structure of the at least one elastic component is disposed on the mounting surface of the heat sink, and two ends of the at least one elastic component are separately fastened to the support; and
the at least one elastic component is configured to provide, to the heat sink, pressure to attach the heat sink to the heat source; and
wherein contact regions between the at least one elastic component and the mounting surface of the heat sink are located at edge positions in an orthographic projection region of the second heat conducting surface of the heat source on the mounting surface of the heat sink; and
the circuit board is located on a side of the support away from the heat sink, and is fastened to the support, and the second heat conducting surface of the heat source faces the assembly opening.
18 . The electronic device according to claim 17 , wherein the peak-valley structure of the at least one elastic component elastically abuts against the mounting surface of the heat sink, and the heat sink is elastically bound to the support.
19 . The electronic device according to claim 17 , wherein the two ends of the at least one elastic component are detachably connected to the support.
20 . The electronic device according to claim 17 , wherein the two ends of the at least one elastic component are detachably connected to the support; and
wherein the two ends of the at least one elastic component separately comprise a hooking portion extending toward the support;
two mounting ends located on two sides of the heat sink are disposed on the support, and mounting holes adapted to the hooking portions are respectively disposed at the two mounting ends; and
the hooking portions at the two ends of the at least one elastic component are respectively clamped into the mounting holes at the two mounting ends;
wherein the heat sink further comprises a heat dissipation structure, and the heat dissipation structure is disposed on a side away from the first heat conducting surface;
the heat dissipation structure comprises a plurality of fins arranged in parallel, a plurality of air ducts are formed between the plurality of fins, and the at least one elastic component correspondingly penetrates an air duct of the plurality of air ducts; and
wherein the support further comprises:
a position-limiting portion, wherein the position-limiting portion is disposed on the bearing portion, and forms, together with the bearing portion, accommodating space for accommodating the heat sink, and the position-limiting portion is disposed around an outer edge of the heat sink,
a position-avoiding notch is disposed on the outer edge of the heat sink;
at least one of the two mounting ends is formed at a joint between the bearing portion and the position-limiting portion; and
the two ends of the at least one elastic component penetrate the position-avoiding notch, and are clamped into the mounting holes.