Patent Assignment
Reel/Frame 075326/0037
Employment Agreement
Recorded: 2026-04-02
Pages: 21
Assignor
LIN, BENWEI
Executed: 2018-08-31
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, 518129, CHINA
Covered Property
(1)
Heat Dissipation Apparatus, Circuit Module, Electronic Device, and Circuit Module Assembly Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.