Patent Assignment
Reel/Frame 075735/0976
Change of Name
Recorded: 2026-06-09
Pages: 4
Assignor
INVENSAS LLC
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(2)
System and Method for Providing 3D Wafer Assembly with Known-Good-Dies
Application:
19/699,518 →
System and Method for Providing 3D Wafer Assembly with Known-Good-Dies
Patent:
50,965 →
Application:
18/242,827 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.