Power module package casing with protrusion supports
A method includes disposing a series of protrusions on a rectangular side panel of an open four-sided box-like structure in a frame, and attaching an electronic substrate to the frame. The electronic substrate carries one or more circuit components. The series of protrusions acts as a spring-like compensator to compensate plastic deformation, twisting or warping of the frame, and to limit propagation of stress to the electronic substrate via the frame.
1. A package, comprising:
an electronic substrate attached to a frame, the electronic substrate coupled to at least one circuit component, the frame including a rectangular panel having a length and a width, the panel forming a side of an open four-sided box-like structure in the frame, the frame including a portion of an assembly for affixing the package to a heat dispersal assembly; and
a plurality of pairs of protrusions with a dimple disposed between each pair of protrusions disposed on a top edge of the rectangular panel along the length of the panel.
2. The package of claim 1 , wherein one pair of the plurality of pairs of the protrusions is disposed mid-length of the panel.
3. The package of claim 1 , wherein at least one protrusion is an oblique protrusion disposed on a slant relative to a horizontal direction along the length of the rectangular panel.
4. The package of claim 3 , wherein each of the at least one protrusion has about a same height in a vertical direction along the width of the rectangular panel.
5. The package of claim 1 , wherein at least one protrusion of the plurality of pairs of protrusions is a non-oblique protrusion having different heights in a vertical direction along the width of the rectangular panel.
6. The package of claim 1 , wherein at least one protrusion of the plurality of pairs of protrusions increases a height of the rectangular panel in a vertical direction along the width of the rectangular panel.
7. The package of claim 1 , wherein the plurality of pairs of protrusions form a spring-like compensator.
8. The package of claim 1 , wherein at least one protrusion of the plurality of pairs of protrusions has one of a rectangular, a trapezoidal, a triangular, or a curved shape profile.
9. The package of claim 1 , wherein the portion includes a nut-and-bolt assembly for affixing the package to the heat dispersal assembly.
10. The package of claim 9 further comprising:
a cover enclosing the frame and the electronic substrate, the cover to readying the package for attachment to a heat dispersal assembly.
11. A package, comprising:
an electronic substrate attached to a frame, the electronic substrate being coupled to at least one circuit component; and
a rectangular panel forming a side of an open four-sided box-like structure in the frame, the rectangular panel having a panel length and a panel width that increases from an end of the rectangular panel toward a mid-point of the panel length so that a top edge surface of the rectangular panel has a slant relative to an axis parallel to the panel length, the rectangular panel further having at least two protrusions separated by a dimple along the panel length, the dimple having a dimple width smaller than a width of each of the at least two protrusions.
12. The package of claim 11 , wherein the at least two protrusions and the dimple form a spring-like compensator.
13. The package of claim 11 , wherein the at least two protrusions and the dimple are disposed mid-length of the panel.
14. The package of claim 11 , wherein at least one of the at least two protrusions is an oblique protrusion disposed on a slant along the length of the rectangular panel.
15. The package of claim 11 , wherein at least one of the at least two protrusions is a non-oblique protrusion.
16. The package of claim 11 , further comprising, a plurality dimples and wherein the plurality of dimples have bottom surfaces at about a same horizontal level along the length of the rectangular panel.
17. A method, comprising:
disposing a plurality of pairs of protrusions with a dimple disposed between each pair of protrusions on a rectangular side panel of an open four-sided box-like structure included in a frame, the rectangular panel having a panel length and a panel width that increases from an end of the rectangular panel toward a mid-point of the panel length so that a top edge surface of the rectangular panel has a slant relative to an axis parallel to the panel length; and
attaching an electronic substrate to the frame, the electronic substrate being coupled to at least one circuit component.
18. The method of claim 17 , wherein the disposing includes disposing at least one protrusion paired with at least one dimple, mid-length along a length of the rectangular side panel, on an edge of the panel.
19. The method of claim 18 , wherein the disposing includes disposing an oblique protrusion having a slanted position on the edge of the rectangular side panel.
20. The method of claim 18 , wherein the disposing includes disposing non-oblique protrusions and non-oblique dimples on the edge along the length of the rectangular side panel.