Semiconductor device package with cap element
View Patent ↗A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.
1. A method of making a surface mount semiconductor device comprising:
providing a substrate structure having an array of substrate elements linked by substrate corner elements and separated by slots extending between said substrate corner elements;
positioning an array of semiconductor dies on said array of substrate elements;
providing a cap, frame and contact structure having a corresponding array of caps supported by corner legs linking said caps to frame corner elements, a plurality of frame elements linking said frame corner elements, and sets of electrical contact elements supported by said frame elements;
aligning said cap, frame and contact structure on said substrate structure, with said caps extending over corresponding semiconductor dies, said frame corner elements extending over said substrate corner elements, and said sets of electrical contact elements disposed in said slots;
connecting said semiconductor dies electrically with said electrical contact elements;
encapsulating said substrate structure, said array of semiconductor dies and said cap, frame and contact structure with a molding compound; and
singulating encapsulated units of said semiconductor dies with the corresponding caps and the corresponding sets of electrical contact elements, wherein said singulating removes said frame elements.
2. The method of claim 1 , wherein said encapsulating leaves said sets of electrical contact elements exposed at a surface of said units.
3. The method of claim 2 , wherein the method includes mounting respective ball grid arrays on said sets of electrical contact elements of said encapsulated units.
4. The method of claim 2 , wherein said connecting said semiconductor dies electrically with said sets of electrical contact elements includes bonding wires to said electrical contact elements and to said dies, said wires passing between said corner legs.
5. The method of claim 4 , wherein said bonding wires to said dies includes bonding wires between said dies and said substrate.
6. The method of claim 1 , wherein said substrate elements provide heat sinks for said semiconductor dies, said substrate structure comprising thermally conductive material.
7. The method of claim 1 , wherein said caps provide heat sinks for said semiconductor dies, said cap, frame and contact structure comprising thermally conductive material.
8. The method of claim 1 , wherein said cap, frame and contact structure comprises electrically conductive material.
9. The method of claim 1 , wherein said cap, frame and contact structure comprises metallic material.