Removal of post-rie polymer on A1/CU metal line
View Patent ↗A method for removal of post reactive ion etch sidewall polymer rails on a Al/Cu metal line of a semiconductor or microelectronic composite structure comprising: 1) supplying a mixture of an etching gas and an acid neutralizing gas into a vacuum chamber in which said composite structure is supported to form a water soluble material of sidewall polymer rails left behind on the Al/Cu metal line from the RIE process; removing the water soluble material with deionized water; and removing photo-resist from said composite structure by either a water-only plasma process or a chemical down stream etching method; or 2) forming a water-only plasma process to strip the photo-resist layer of a semiconductor or microelectronic composite structure previously subjected to a RIE process; supplying a mixture of an etching gas and an acid neutralizing gas into a vacuum chamber on which said structure is supported to form a water soluble material of saidwall polymer rails left behind on the Al/Cu metal line from the RIE process; and removing the water soluble material with deionized water.
1. In a metal etch tool for removing post-RIE polymer rails formed on a Al/Cu metal line of a semiconductor structure, the improvement comprising:
an integrated metal etch tool interfaced with:
a) strip chamber means to strip photo-resist of a semiconductor composite structure subsequent to a RIE to limit thickness of sidewall polymer rails;
b) vacuum chamber means to chemically modify sidewall polymer rails with HF/NH 3 to form a water soluble residue material of sidewall polymer rails left behind on a Al/Cu metal line form the RIE process; and
c) rinse chamber means to remove soluble material in deionized water.
2. The integrated metal etch tool of claim 1 wherein said strip chamber means conducts a water-only plasma at temperatures between about 175° C.-200° C.
3. The integration metal tool of claim 1 wherein said strip chamber means conducts a water-only plasma at temperatures greater than 200° C. thereby forming a passivation layer on the Al/Cu metal line surface.
4. In a metal etch tool for removing post-RIE polymer rails formed on a Al/Cu metal line of a semiconductor structure, the improvement comprising:
an integrated metal etch tool interfaced with:
(a) vacuum chamber means to form a water soluble residue material of sidewall polymer rails with HF/NH 3 left behind on Al/Cu metal line from the RIE process; and
(b) strip chamber means for down stream etching removal of photo-resist from said structure.
5. The integrated metal etch tool of claim 4 wherein said strip chamber means conducts chemical down stream etching at temperatures greater than 200° C. thereby forming a passivation layer on the Al/Cu metal line surface.