Patent Assignment
Reel/Frame 037221/0885
Assignment of Assignor's Interest
Recorded: 2015-12-07
Pages: 8
Assignor
INFINEON TECHNOLOGIES AG
Executed: 2015-09-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Properties
(56)
Etching High Aspect Contact Holes in Solid State Devices
Patent:
6,008,121 →
Application:
08/618,161 →
Crack Stop Formation for High-Productivity Processes
Patent:
5,776,826 →
Application:
08/642,983 →
Pad Stack with a Poly Si Etch Stop for Teos Mask Removal with Rie
Patent:
5,776,808 →
Application:
08/777,156 →
Crack Stops
Patent:
5,789,302 →
Application:
08/823,668 →
Dummy Patterns for Aluminum Chemical Polishing (Cmp)
Patent:
6,093,631 →
Application:
09/007,911 →
Reduced Voltage Input/Reduced Voltage Output Tri-State Buffers
Patent:
6,181,165 →
Application:
09/037,289 →
Device Interconnection
Patent:
6,870,263 →
Application:
09/052,688 →
Crack Stops
Patent:
6,025,639 →
Application:
09/061,538 →
Removal of Post-Rie Polymer on A1/Cu Metal Line
Patent:
5,980,770 →
Application:
09/061,565 →
Geometrical Control of Device Corner Threshold
Patent:
5,998,852 →
Application:
09/078,517 →
Semiconductor Structure Including a Conductive Fuse and Process for Fabrication Thereof
Patent:
6,037,648 →
Application:
09/105,647 →
Geometrical Control of Device Corner Threshold
Patent:
6,022,796 →
Application:
09/120,190 →
A Method of Manufacturing Semiconductor Structures Including a Pair of Mosfets
Patent:
6,096,664 →
Application:
09/130,324 →
Electrical Fuses with Tight Pitches and Method of Fabrication in Semiconductors
Patent:
6,008,523 →
Application:
09/140,573 →
Removal of Post-Rie Polymer on A1/Cu Metal Line
A Repairable Semiconductor Memory Circuit Having Parallel Redundancy Replacement Wherein Redundancy Elements Replace Failed Elements
Patent:
6,052,318 →
Application:
09/218,561 →
Crack Stops
Patent:
6,271,578 →
Application:
09/218,882 →
Driver Circuit with Negative Lower Power Rail
Patent:
6,127,878 →
Application:
09/225,664 →
Crack Stops
Patent:
6,084,287 →
Application:
09/241,741 →
Dynamic Logic Circuit
Patent:
6,262,615 →
Application:
09/257,304 →
Current Source
Patent:
6,087,820 →
Application:
09/265,252 →
Capacitive Coupled Driver Circuit
Patent:
6,215,349 →
Application:
09/265,253 →
Hierarchical Prefetch for Semiconductor Memories
Patent:
6,081,479 →
Application:
09/333,539 →
Synchronized Data Capturing Circuits Using Reduced Voltage Levels and Methods Therefor
Patent:
6,668,031 →
Application:
09/377,588 →
Semiconductor Structures and Manufacturing Methods
Patent:
6,740,555 →
Application:
09/408,248 →
Prefetch Architectures for Data and Time Signals in an Integrated Circuit and Methods Therefor
Patent:
6,529,054 →
Application:
09/425,329 →
Optimized Decoupling Capacitor Using Lithographic Dummy Filler
Patent:
6,232,154 →
Application:
09/442,890 →
High Performance Cmos Word-Line Driver
Patent:
6,236,617 →
Application:
09/458,878 →
Receiver with switched current feedback for controlled hysteresis
Patent:
6,275,082 →
Application:
09/519,104 →
Cbr refresh control for the redundancy array
Patent:
6,195,300 →
Application:
09/536,185 →
Optimized decoupling capacitor using lithographic dummy filler
Patent:
6,353,248 →
Application:
09/562,220 →
Orientation independent oxidation of silicon
Patent:
6,358,867 →
Application:
09/596,097 →
Power Controlled Input Receiver
Patent:
6,462,613 →
Application:
09/597,121 →
Design Layout for a Dense Memory Cell Structure
Patent:
6,396,096 →
Application:
09/597,401 →
Semiconductor Structures and Manufacturing Methods
Patent:
6,605,860 →
Application:
09/597,442 →
Semiconductor Structure and Method of Fabrication Including Forming Aluminum Columns
Patent:
6,635,564 →
Application:
09/662,424 →
Buffers with Reduced Voltage Input/Output Signals
Patent:
6,426,658 →
Application:
09/676,864 →
Method for Eliminating Crack Damage Induced by Delaminating Gate Conductor Interfaces in Integrated Circuits
Patent:
6,492,247 →
Application:
09/717,970 →
Multi-Level Fuse Structure
Method for Low Temperature Chemical Vapor Deposition of Low-K Films Using Selected Cyclosiloxane and Ozone Gases for Semiconductor Applications
Unit-Architecture with Implemented Limited Bank-Column-Select Repairability
Gate Processing Method with Reduced Gate Oxide Corner and Edge Thinning
Process for Forming a Damascene Structure
Twisted Bit-Line Compensation for Dram Having Redundancy
Patent:
6,570,794 →
Application:
10/034,626 →
Rtcvd Process and Reactor for Improved Conformality and Step-Coverage
Patent:
6,576,565 →
Application:
10/075,152 →
Repeater with Reduced Power Consumption
Method to Enhance Epi-Regrowth in Amorphous Poly Cb Contacts
Reduced Hot Carrier Induced Parasitic Sidewall Device Activation in Isolated Buried Channel Devices by Conductive Buried Channel Depth Optimization
Adhesion Layer for Pt on SIO2
Methods and Apparatus for Providing an Antifuse Function
Method for Improved Alignment of Magnetic Tunnel Junction Elements
Phase Change Memory Cell Having a Sidewall Contact
Phase Change Memory Cell Design with Adjusted Seam Location
Integrated Circuit Including Silicide Region to Inhibit Parasitic Currents
Concentric Phase Change Memory Element
Concentric Phase Change Memory Element
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 14, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023788/0535 →
Assignment of Assignor's Interest
Jan 14, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023853/0401 →
Assignment of Assignor's Interest
Jan 14, 2010
From: INFINEON TECHNOLOGIES NORTH AMERICA CORPORATION
To: QIMONDA AG
Reel/Frame 023791/0001 →
Assignment of Assignor's Interest
Feb 22, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023963/0502 →
Assignment of Assignor's Interest
May 8, 2015
From: QIMONDA AG
To: INFINEON TECHNOLOGIES AG
Reel/Frame 035623/0001 →
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →