Method and apparatus for fast automated failure classification for semiconductor wafers
View Patent ↗A method for classifying patterns of failcodes on a semiconductor wafer, in accordance with the present invention, includes determining failcodes for chips on the wafer and checking adjacent chips for each chip on the wafer having a failcode to determine a failcode pattern having a defined number of chips.
1. A method for classifying patterns of failcodes on a semiconductor wafer, comprising the steps of:
determining failcodes for chips on the wafer;
checking adjacent chips for each chip on the wafer having a failcode to determine a failcode pattern having a defined number of chips, wherein the step of checking comprises determining once for each chip having a failcode, adjacent chips having the same failcode, tracking adjacent chips having the same failcode, and determining a pattern of chips having the same failcode upon tracking a defined number of adjacent chips having the same failcode; and
outputting the failcode pattern to analyze the wafer.
2. The method of claim 1 , wherein the defined number of adjacent chips having the same failcode is determined in accordance with a cluster size, which serves as a threshold for recognition of a pattern.
3. The method of claim 2 , wherein cluster size is adjustable to provide a sensitivity for pattern detection.
4. The method of claim 1 , wherein the step of checking adjacent chips for each chip on the wafer includes flagging each chip as a good chip, part of a detected pattern or under investigation.
5. A method for classifying patterns of failcodes on a semiconductor wafer, comprising steps of:
providing failure information from a wafer tester;
determining failcodes for chips on the water by employing the failure information,
checking adjacent chips for each chip on the wafer to determine if the adjacent chips have a same failcode;
determining a pattern of chips having the same failcode upon tracking a defined number of chips; and
outputting the failcode pattern to analyze the wafer.
6. The method of claim 5 , wherein the step of checking adjacent chips further comprises the steps of:
determining once for each chip having a failcode adjacent chips having the same failcode.
7. The method of claim 5 , wherein the step of checking adjacent chips includes tracking adjacent chips having the same failcode until a determination of a pattern is made.
8. The method of claim 5 , wherein the defined number of chips is determined in accordance with a cluster size, which serves as a threshold for recognition of a pattern.
9. The method of claim 8 , wherein cluster size is adjustable to provide a sensitivity for pattern detection.
10. The method of claim 5 , wherein the step of checking adjacent chips includes flagging each chip as a good chip, part of a detected pattern or under investigation.
11. A program storage device readable by machine, tangibly embodying a program of instructions executable by the machine to perform method steps for classifying patterns of failcodes on a semiconductor wafer, the method steps comprising:
determining failcodes for chips on the wafer;
checking adjacent chips for each chip on the wafer having a failcode to determine a failcode pattern having a defined number of chips, wherein the step of checking comprises determining once for each chip having a failcode, adjacent chips having the same failcode, tracking adjacent chips having the same failcode, and determining a pattern of chips having the same failcode upon tracking a defined number of adjacent chips having the same failcode; and
outputting the failcode pattern to analyze the wafer.
12. The program storage device of claim 11 , wherein the defined number of adjacent chips having the same failcode is determined in accordance with a cluster size, which serves as a threshold for recognition of a pattern.
13. The program storage device of claim 12 , wherein cluster size is adjustable to provide a sensitivity for pattern detection.
14. The program storage device of claim 11 , wherein the step of checking adjacent chips for each chip on the wafer includes flagging each chip as a good chip, part of a detected pattern or under investigation.
15. A computer program product comprising a computer usable medium having a computer readable program code embodied therein for a recursive classification of semiconductor wafers, the computer readable program code in the computer program product comprising:
computer readable program code for causing a computer to determine whether a chip on the wafer has a pass or a failcode;
computer readable program code for causing the computer to determine a characteristic failcode for each chip having a failcode;
computer readable program code for causing the computer to add a first chip to a temporary array, if the first chip has a failcode,
computer readable program code for causing the computer to determine adjacent chips having the same failcode as the first chip;
computer readable program code for causing the computer to add an adjacent second chip having the same failcode to the temporary array; and
computer readable program code for causing the computer to classify the temporary array of chips having the same failcode as a pattern upon identifying at least a predefined number of chips in the temporary array.