IP Library › Granted Patent US 6,566,041
Granted Patent Utility
US 6,566,041 · Confirmation No. 8170

PHOTOMASK AND PATTERN FORMING METHOD USED IN A THERMAL FLOW PROCESS AND SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATED USING THE THERMAL FLOW PROCESS

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 Code Description Pages PDF
2001-01-10 TRNA Transmittal of New Application 1 View
2001-01-10 SPEC Specification 24 View
2001-01-10 CLM Claims 6 View
2001-01-10 ABST Abstract 1 View
2001-01-10 DRW Drawings-only black and white line drawings 7 View
2001-01-10 OATH Oath or Declaration filed 3 View
2001-01-10 TRNA Transmittal of New Application 1 View
2001-01-10 SPEC Specification 24 View
2001-01-10 CLM Claims 6 View
2001-01-10 ABST Abstract 1 View
2001-01-10 DRW Drawings-only black and white line drawings 7 View
2001-01-10 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,566,041
App. No.
09/757,841
Filed
2001-01-10
Granted
2003-05-20
Pub. No.
US20010007732A1
Art Unit
1756
PTA
-63 days