IP Library Granted Patent US 6,303,524
Granted Patent Utility
US 6,303,524 · Confirmation No. 5546

High temperature short time curing of low dielectric constant materials using rapid thermal processing techniques

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Code Description Pages PDF
2017-10-16 IMIS Miscellaneous Internal Document 1 View
2001-02-20 TRNA Transmittal of New Application 2 View
2001-02-20 SPEC Specification 29 View
2001-02-20 CLM Claims 5 View
2001-02-20 ABST Abstract 1 View
2001-02-20 DRW Drawings-only black and white line drawings 4 View
2001-02-20 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,303,524
App. No.
09/789,062
Filed
2001-02-20
Granted
2001-10-16
Art Unit
2812
PTA
-50 days