Granted Patent
Utility
US 6,498,381
· Confirmation No. 9148
SEMICONDUCTOR STRUCTURES HAVING MULTIPLE CONDUCTIVE LAYERS IN AN OPENING, AND METHODS FOR FABRICATING SAME
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2020-06-11 | OATH |
Oath or Declaration filed | 262 | View | |
| 2012-07-02 | N570 |
Communication - Re: Power of Attorney (PTOL-308) | 1 | View | |
| 2012-07-02 | N570 |
Communication - Re: Power of Attorney (PTOL-308) | 1 | View | |
| 2012-06-21 | PA.. |
Power of Attorney | 1 | View | |
| 2012-06-21 | R3.73 |
Assignee showing of ownership per 37 CFR 3.73 | 1 | View | |
| 2012-06-21 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2001-02-22 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-02-22 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-02-22 | SPEC |
Specification | 16 | View | |
| 2001-02-22 | CLM |
Claims | 5 | View | |
| 2001-02-22 | ABST |
Abstract | 1 | View | |
| 2001-02-22 | DRW |
Drawings-only black and white line drawings | 21 | View | |
| 2001-02-22 | OATH |
Oath or Declaration filed | 2 | View | |
| 2001-02-22 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-02-22 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-02-22 | SPEC |
Specification | 16 | View | |
| 2001-02-22 | CLM |
Claims | 5 | View | |
| 2001-02-22 | ABST |
Abstract | 1 | View | |
| 2001-02-22 | DRW |
Drawings-only black and white line drawings | 21 | View | |
| 2001-02-22 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Patrick B. Halahan
San Mateo, CA
Oleg Siniaguine
San Carlos, CA
Attorneys & Agents of Record
Classification
USPC
257/449
H10W20/01
H10W42/20
H10W72/07251
H10W20/0245
H10W20/2125
H10W20/20
H10W20/0249
H10W72/20
H10W20/2128
H10W20/216
H10W44/212
H10W20/023
Y10S438/977
Prosecution
- Examiner
- ORTIZ, EDGARDO
- Art Unit
- 2815
- Customer No.
- 101925
- Confirmation No.
- 9148
Publication
- Pub. No.
- US20020115290A1
- Pub. Date
- 2002-08-22
Patent Term Adjustment
0days
TESSERA, INC.,
INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.),
FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS),
INVENSAS CORPORATION,
TESSERA ADVANCED TECHNOLOGIES, INC,
DTS, INC.,
DTS LLC,
PHORUS, INC.,
IBIQUITY DIGITAL CORPORATION
from
ROYAL BANK OF CANADA
RELEASE OF SECURITY INTEREST
Recorded 2020-06-11
from
DTS, INC.,
IBIQUITY DIGITAL CORPORATION,
INVENSAS BONDING TECHNOLOGIES, INC.,
INVENSAS CORPORATION,
PHORUS, INC.,
ROVI GUIDES, INC.,
ROVI SOLUTIONS CORPORATION,
ROVI TECHNOLOGIES CORPORATION,
TESSERA ADVANCED TECHNOLOGIES, INC.,
TESSERA, INC.,
TIVO SOLUTIONS INC.,
VEVEO, INC.
SECURITY INTEREST
Recorded 2020-06-01
from
DIGITALOPTICS CORPORATION,
DIGITALOPTICS CORPORATION MEMS,
DTS, INC.,
DTS, LLC,
IBIQUITY DIGITAL CORPORATION,
INVENSAS CORPORATION,
PHORUS, INC.,
TESSERA ADVANCED TECHNOLOGIES, INC.,
TESSERA, INC.,
ZIPTRONIX, INC.
SECURITY INTEREST
Recorded 2016-12-02
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-02-22
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Quick Facts
- Patent No.
- US 6,498,381
- App. No.
- 09/792,311
- Filed
- 2001-02-22
- Granted
- 2002-12-24
- Pub. No.
- US20020115290A1
- Examiner
- ORTIZ, EDGARDO
- Art Unit
- 2815
- PTA
- 0 days
External Links