Granted Patent
Utility
US 6,316,275
· Confirmation No. 2154
Method for fabricating a semiconductor component
Inventor:
Joachim Hopfner
|
⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2001-02-26 | TRNA |
Transmittal of New Application | 1 | View | |
| 2001-02-26 | SPEC |
Specification | 20 | View | |
| 2001-02-26 | CLM |
Claims | 6 | View | |
| 2001-02-26 | ABST |
Abstract | 1 | View | |
| 2001-02-26 | DRW |
Drawings-only black and white line drawings | 3 | View | |
| 2001-02-26 | OATH |
Oath or Declaration filed | 2 | View |
Inventors
Joachim Hopfner
Planegg, GERMANY
Attorneys & Agents of Record
Classification
USPC
438/3
H10B12/00
H10B53/00
H10P95/00
H10B12/0335
H10B53/30
H10D1/682
Prosecution
- Examiner
- TSAI, HUI JEY
- Art Unit
- 2812
- Docket No.
- GR 00 P 4028 US
- Confirmation No.
- 2154
Foreign Priority
100 10 284.0
·
2000-02-25
·
GERMANY
Publication
- Pub. No.
- US20010021554A1
- Pub. Date
- 2001-09-13
Patent Term Adjustment
-23days
No related applications found.
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2015-09-03
from
HOPFNER, JOACHIM
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2001-09-24
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Quick Facts
- Patent No.
- US 6,316,275
- App. No.
- 09/793,351
- Filed
- 2001-02-26
- Granted
- 2001-11-13
- Pub. No.
- US20010021554A1
- Examiner
- TSAI, HUI JEY
- Art Unit
- 2812
- PTA
- -23 days
External Links