IP Library Granted Patent US 6,440,771
Granted Patent Utility
US 6,440,771 · Confirmation No. 8018

METHOD FOR CONSTRUCTING A WAFER INTERPOSER BY USING CONDUCTIVE COLUMNS

Inventor: John L. Pierce
Patented Case View Patent ↗
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Code Description Pages PDF
2008-09-24 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2008-09-24 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2008-09-10 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2008-09-10 N417 Electronic Filing System Acknowledgment Receipt 2 View
2008-09-10 PA.. Power of Attorney 1 View
2001-03-23 TRNA Transmittal of New Application 2 View
2001-03-23 SPEC Specification 11 View
2001-03-23 CLM Claims 6 View
2001-03-23 ABST Abstract 1 View
2001-03-23 DRW Drawings-only black and white line drawings 5 View
2001-03-23 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,440,771
App. No.
09/816,516
Filed
2001-03-23
Granted
2002-08-27
Art Unit
2813
PTA
-49 days