IP Library › Assignment 021450/0271
Patent Assignment
Reel/Frame 021450/0271

Assignment of Assignor's Interest

Recorded: 2008-08-28 Pages: 7
Assignor
Assignee
TRANSPACIFIC MULTICAST, LLC
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Properties (19)
Wafer Level Interposer
Patent: 6,392,428 →
Application: 09/440,751 →
Chip Assembly with Integrated Power Distribution Between a Wafer Interposer and an Integrated Circuit Chip
Patent: 6,483,043 →
Application: 09/574,361 →
Method for Manufacturing a Wafer-Interposer Assembly
Patent: 6,812,048 →
Application: 09/628,531 →
Method for Selecting Components for a Matched Set Using a Multi Wafer Interposer
Patent: 6,537,831 →
Application: 09/629,309 →
Method for Testing Multiple Semiconductor Wafers
Patent: 6,822,469 →
Application: 09/629,326 →
Method for Selecting Components for a Matched Set Using Wafer Interposers
Patent: 6,483,330 →
Application: 09/659,152 →
Method for Selecting Components for a Matched Set from a Wafer-Interposer Assembly
Patent: 6,815,712 →
Application: 09/678,163 →
Interposer for Improved Handling of Semiconductor Wafers and Method of Use of Same
Patent: 6,686,657 →
Application: 09/707,873 →
Wafer Testing Interposer for a Conventional Package
Patent: 6,529,022 →
Application: 09/737,925 →
Publication: US 2002/0075022
Method for Building an Interposer Onto a Semiconductor Wafer Using Laser Techniques
Patent: 6,524,885 →
Application: 09/738,228 →
Publication: US 2002/0076855
Wafer-Interposer Using a Ceramic Substrate
Patent: 6,673,653 →
Application: 09/792,257 →
Publication: US 2002/0119600
Method for Constructing a Wafer Interposer by Using Conductive Columns
Patent: 6,440,771 →
Application: 09/816,516 →
Wafer Level Interposer
Patent: 6,825,678 →
Application: 10/106,167 →
Publication: US 2002/0097063
Matched Set of Integrated Circuit Chips Selected from a Multi Wafer Interposer
Patent: 6,759,741 →
Application: 10/371,013 →
Publication: US 2003/0129775
Wafer Interposer Assembly
Patent: 6,933,617 →
Application: 10/373,413 →
Publication: US 2003/0148108
Method for Producing a Wafer Interposer for Use in a Wafer Interposer Assembly
Patent: 7,036,218 →
Application: 10/373,414 →
Publication: US 2003/0128044
Method for Constructing a Wafer-Interposer Assembly
Patent: 6,927,083 →
Application: 10/771,796 →
Publication: US 2004/0166663
Wafer-Interposer Assembly
Patent: 6,967,494 →
Application: 10/772,951 →
Publication: US 2004/0155328
System for Testing Semiconductor Die on Multiple Semiconductor Wafers
Patent: 6,927,593 →
Application: 10/860,679 →
Publication: US 2004/0217772
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 16, 1999
From: KLINE, JERRY D.; SMITH, JR., CECIL E.
To: MICRO-ASI, INC
Reel/Frame 010412/0512 →
Assignment of Assignor's Interest May 19, 2000
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 010835/0827 →
Assignment of Assignor's Interest Jul 31, 2000
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 011018/0572 →
Assignment of Assignor's Interest Sep 11, 2000
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 011098/0897 →
Assignment of Assignor's Interest Oct 2, 2000
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 011207/0467 →
Assignment of Assignor's Interest Oct 10, 2000
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 011167/0904 →
Assignment of Assignor's Interest Oct 16, 2000
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 011188/0590 →
Assignment of Assignor's Interest Nov 7, 2000
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 011276/0595 →
Assignment of Assignor's Interest Sep 10, 2002
From: PIERCE, JOHN L.
To: MICRO-ASI, INC.
Reel/Frame 013275/0854 →
Assignment of Assignor's Interest Feb 20, 2003
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 013806/0321 →
Assignment of Assignor's Interest Feb 24, 2003
From: PIERCE, JOHN L.
To: MICRO-ASI, INC.
Reel/Frame 013818/0469 →
Assignment of Assignor's Interest Feb 24, 2003
From: PIERCE, JOHN L.
To: MICRO-ASI, INC.
Reel/Frame 013818/0549 →
Assignment of Assignor's Interest Apr 7, 2003
From: PIERCE, JOHN L.
To: MICRO-ASI, INC.
Reel/Frame 013994/0670 →
Assignment of Assignor's Interest Mar 31, 2005
From: KLINE, JERRY D.; SMITH, CECIL E., JR.
To: MICRO-ASI, INC.
Reel/Frame 015991/0058 →
Assignment of Assignor's Interest Mar 31, 2005
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 015989/0663 →
Assignment of Assignor's Interest Mar 31, 2005
From: PIERCE, JOHN L.
To: MICRO-ASI, INC.
Reel/Frame 015980/0941 →
Assignment of Assignor's Interest Mar 31, 2005
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 015989/0675 →
Security Agreement Jun 13, 2005
From: MICRO-ASI, INC.
To: EAGLESTONE INVESTMENT PARTNERS I, L.P.
Reel/Frame 016127/0641 →
Assignment of Assignor's Interest Jun 13, 2005
From: KLINE, MR. JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 016132/0779 →
Security Agreement Nov 30, 2005
From: MICRO-ASI, INC.
To: EAGLESTONE INVESTMENT PARTNERS I, L.P.
Reel/Frame 016835/0032 →
Assignment of Assignor's Interest Aug 25, 2008
From: PIERCE, JOHN L.
To: MICRO-ASI, INC.
Reel/Frame 021428/0736 →
Assignment of Assignor's Interest Aug 25, 2008
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 021428/0724 →
Corrective Assignment to Correct the Execution Date Provided in the Conveying Party Data on the Recordation Cover Sheet Previously Recorded on Reel 021428 Frame 0724. Assignor(S) Hereby Confirms the Execution Date Should Be 8/21/2008. Mar 13, 2009
From: KLINE, JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 022390/0663 →
Assignment of Assignor's Interest Feb 12, 2023
From: TRANSPACIFIC MULTICAST, LLC
To: INTELLECTUAL VENTURES ASSETS 191 LLC
Reel/Frame 062666/0758 →
Security Interest Mar 24, 2023
From: MIND FUSION, LLC
To: INTELLECTUAL VENTURES ASSETS 191 LLC; INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 063295/0001 →