Patent Assignment
Reel/Frame 016835/0032
Security Agreement
Recorded: 2005-11-30
Pages: 12
Assignor
MICRO-ASI, INC.
Executed: 2001-04-26
Assignee
EAGLESTONE INVESTMENT PARTNERS I, L.P.
400 OCEANGATE, SUITE 1125, LONG BEACH, CALIFORNIA, 90802
Covered Properties
(3)
System, method and apparatus for constructing a semiconductor wafer-interposer using B-Stage laminates
Application:
09/738,193 →
Publication:
US 2002/0076854
Method for Constructing a Wafer Interposer by Using Conductive Columns
Patent:
6,440,771 →
Application:
09/816,516 →
System for Testing Semiconductor Die on Multiple Semiconductor Wafers
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 7, 2002
From: PIERCE, JOHN L.
To: MICRO-ASI, INC.
Reel/Frame 013384/0128 →
Assignment of Assignor's Interest
Jun 13, 2005
From: KLINE, MR. JERRY D.
To: MICRO-ASI, INC.
Reel/Frame 016132/0779 →
Assignment of Assignor's Interest
Aug 25, 2008
From: PIERCE, JOHN L.
To: MICRO-ASI, INC.
Reel/Frame 021428/0736 →
Assignment of Assignor's Interest
Aug 28, 2008
From: EAGLESTONE INVESTMENT PARTNERS I, L.P.
To: TRANSPACIFIC MULTICAST, LLC
Reel/Frame 021450/0271 →