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Patent Assignment
Reel/Frame 062666/0758

Assignment of Assignor's Interest

Recorded: 2023-02-12 Pages: 4
Assignor
TRANSPACIFIC MULTICAST, LLC
Executed: 2022-12-29
Assignee
INTELLECTUAL VENTURES ASSETS 191 LLC
251 LITTLE FALLS DRIVE, WILMINGTON, DELAWARE, 19808
Covered Properties (2)
Method for Building an Interposer Onto a Semiconductor Wafer Using Laser Techniques
Patent: 6,524,885 →
Application: 09/738,228 →
Publication: US 2002/0076855
Wafer Interposer Assembly
Patent: 6,933,617 →
Application: 10/373,413 →
Publication: US 2003/0148108
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 24, 2003
From: PIERCE, JOHN L.
To: MICRO-ASI, INC.
Reel/Frame 013818/0469 →
Assignment of Assignor's Interest Mar 31, 2005
From: PIERCE, JOHN L.
To: MICRO-ASI, INC.
Reel/Frame 015980/0941 →
Security Agreement Jun 13, 2005
From: MICRO-ASI, INC.
To: EAGLESTONE INVESTMENT PARTNERS I, L.P.
Reel/Frame 016127/0641 →
Assignment of Assignor's Interest Aug 28, 2008
From: EAGLESTONE INVESTMENT PARTNERS I, L.P.
To: TRANSPACIFIC MULTICAST, LLC
Reel/Frame 021450/0271 →
Security Interest Mar 24, 2023
From: MIND FUSION, LLC
To: INTELLECTUAL VENTURES ASSETS 191 LLC; INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 063295/0001 →
Assignment of Assignor's Interest Jul 13, 2023
From: INTELLECTUAL VENTURES ASSETS 191 LLC
To: MIND FUSION, LLC
Reel/Frame 064270/0685 →