Method for the metalization of an insulator and/or a dielectric
View Patent ↗The invention relates to a process for the metallization of an insulator and/or a dielectric, wherein the insulator is firstly activated, it is subsequently coated with another insulator and the latter is patterned, then the first is seeded and lastly metallized.
1. A process for metallizing at least one insulating layer of an electronic or microelectronic component, which comprises:
applying at least one first insulating layer to a substrate such that the first insulating layer has a thickness not greater than 50 μm;
activating the entire first insulating layer by treatment with an activator, the activator being at least one of a gas, a liquid, a solution, and a plasma;
then, after activating the entire first insulating layer, applying to the first insulating layer a second insulating layer made of a photosensitive material, and patterning the second insulating layer made of a photosensitive material; and
then, after applying and patterning the second insulating layer, seeding and metallizing regions of the first insulating layer that are exposed by the patterning step.
2. The process according to claim 1 , which comprises forming the first insulating layer and the second insulating layer from the same material.
3. The process according to claim 2 , which comprises patterning the first insulating layer before the entire first layer is activated and before the second insulating layer is applied.
4. The process according to claim 1 , which comprises patterning the first insulating layer before the entire first layer is activated and before the second insulating layer is applied.
5. The process according to claim 1 , wherein the first insulating layer is a buffer coating.